Universal smart chip designer Biren Technology has announced a Series B funding round. In just over a year since its establishment, the accumulated financing amount of Bishan Science and Technology has exceeded 4.7 billion yuan, setting a record in the financing speed and financing scale in this field and becoming the fastest growing “unicorn” enterprise. The rapid construction of a solid capital barrier in a short period of time will become an important guarantee for precipitate science and technology to continue to attract top talents in the industry, lead technological innovation and promote large-scale application.
The B round financing of Bishan Technology continues to receive strong support from many well-known industries and financial investment institutions. This round of financing by ping an, new world group, country garden venture jointly led, the source code in the country of the Capital, Goldman sachs group inc. to funds, harvest Capital, China merchants Capital, BAI (bertelsmann Asia investment fund), citic securities investment, interpretation of Capital, common homeland big bay scene development funds, investment funds between China and Russia, and jade Capital and Capital (MSA), China Capital with, such as existing investors IDG Capital, YunHui Capital, zhuhai hengqin group continue to increase investment.
Since its establishment, Bishren Technology has not only completed several rounds of financing led by Qiming Venture Capital, IDG Capital, Walden International China Fund and Hillhouse Venture Capital in a short period of time, but also made many milestones in product technology research and development, talent team building and other aspects.
Bren Technology, founded in 2019, is committed to the development of original universal computing systems, the establishment of efficient software and hardware platforms, while providing integrated solutions in the field of intelligent computing. From the development path, Bidu Technology will first focus on cloud general intelligent computing, and gradually catch up with existing solutions in artificial intelligence training and reasoning, graphics rendering, high-performance general computing and other fields, so as to achieve a breakthrough in domestic high-end general intelligent computing chips.